Broken Silicon 83: Intel going Fabless, Global Foundries for RDNA2, Next Gen Memory | Dave Eggleston (Patreon)
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Dave Eggleston has been a Product Engineer, VP, and CEO at multiple Semiconductor Companies over the past 40 years. He joins Tom to discuss the past, present, and future of memory.
0:00 Dave Eggleston Background (AMD, Sandisk, Micron, Global Foundries)
17:54 The Future of Global Foundries, and TSMC’s potential domination of the market
21:44 Why doesn’t AMD Manufacture Some RDNA 2 Cards at Global Foundries?
31:05 Can and/or should Intel spin off their fabs?
36:14 How has memory evolved over the last 40 years?
45:45 How has storage changed over time? What’s the hardest part of designing storage?
49:35 Why did it take so long to get fast PCIE Gen4 SSDs? Why did HMC fail against HBM?
57:20 Why don’t we focus more on performance of storage versus capacity?
1:02:46 Is Intel Optane a failure? Is it being properly utilized?
1:16:59 CXL – will it replace NVMe? What is the future of tiered memory?
1:23:58 The Future of Consumer Storage
1:40:49 What type of memory will next gen consoles like the PS6 utilized?
1:59:59 The Future of Chip Design & Processing
https://www.linkedin.com/in/deggleston/
https://semiwiki.com/wikis/company-wikis/globalfoundries-wiki/
https://www.congress.gov/bill/116th-congress/house-bill/7178
https://en.wikipedia.org/wiki/Hybrid_Memory_Cube
https://www.nextplatform.com/2019/10/23/a-look-inside-the-groq-approach-to-ai-inference/