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Hey, everyone!

Simple post here. The Failure Analysis lab we worked with just sent us a super high resolution Scanning Electron Microscope shot of the Ryzen 7800X3D. It's specifically the cross-sectioned CCD that we showed in our video (already live on the public channel: https://www.youtube.com/watch?v=fFNi3YNJXbY

Since we already published the video, we obviously can't go back and include this image. It doesn't show anything "new" in terms of failures, it's just super cool and educational.

What you're looking at are TSVs, or Through-Silicon Vias, right in the middle in that almost traffic cone-shaped tunnel. There's a scale present on the screen to help illustrate the distances. 

Cool stuff! Wanted to share. Thanks for your support, Patreon backers!

(sorry for the annoying watermark - some people were ripping our top-right mark out of the images)

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Comments

Anonymous

Sorry I dont understand the scale, could you add a banana for reference? 🤣🤣😉

Anonymous

The scale at which these devices are manufactured is mind boggling. It's a true wonder that any of it even works at all. Thanks Steve and team.

Moritz Wundke

Super nice! Thanks for sharing ^^

AgentBirdnest

Wow! I love images like this. Am I correct in remembering that the width of a human hair is typically 50-100µ ? So this entire image is about the thickness of one of my hairs... Absolutely mind-blowing.

L'Ancien

and we can't even make up the active bits. if you imagine those interconnects being a skyscraper, transistors would probably be the size of a cat ^^' From Derbauer's video i believe the gate width on Zen3 was like just under 20nm. The interconnects on the X3D chip are 10500nm tall (10.5µm). it's a veeeeeeeery wide shot

Anonymous

Thanks for that perspective! Just amazing the scale. As a tech writer, I would really love to add callouts to this photo.